首页 Smart card machine Module Placement Machine XDL-HMPP200 Module Placement Machine XDL-HMPP200 XDL-HMPP200 module placement machine with servo-controlled precise positioning and advanced dispensing technology. 分类: Smart card machine 描述 描述 Features: Stable running, flat chip placing and accurate position Layouts can be saved by CPU and each one can be used directly Precise position locating controlled by servo system Advanced dispensing technology is used to ensure placing of chips 相关产品 Antenna Bonding Machine Wire Embedding Machine XDL-WE200 Contact-less Card Spectrum Analyzer wireembedding machine
描述 Features: Stable running, flat chip placing and accurate position Layouts can be saved by CPU and each one can be used directly Precise position locating controlled by servo system Advanced dispensing technology is used to ensure placing of chips